We have developed a high-speed microscopic defect AOI measurement platform tailored for the semiconductor and optical communications industries. It features three core technologies:
1. Optical imaging technology (with all core components manufactured domestically)
Minimum detectable defect size of 0.18 μm, with measurement accuracy reaching the sub-nanometer level. Additionally, it integrates a line-spectral confocal module, a white-light interferometry module, a deep-ultraviolet light source, and atomic force microscopy applications to meet the industry’s 2D, 2.5D, and 3D inspection and measurement needs. It ranks among the top tier in the industry for comprehensive micro-inspection imaging applications and precision.
2. DD+DB+Starline Enhanced Algorithm
Leveraging accumulated AI data to enable quality traceability and provide feedback to upstream processes. By establishing multidimensional correlations between end-of-line inspection data and upstream process parameters, the system can precisely pinpoint the root causes of defects.
3. High-Precision Motion Control Platform
High-precision marble platform + air-bearing inspection motion control platform: Features independently designed high-precision drive control rails and feedback algorithm compensation control to ensure machine positioning accuracy.