The LQ-LGWS-30 is an ultrafast laser glass bonding equipment independently developed by Lieqi Intelligence, which is mainly used in glass bonding with glass, Si, SiC , Invar steel and copper. The system adopts an infrared femtosecond laser. The laser beam is expanded and focused to create an extremely small spot at the bonding interface between the two glass layers. Leveraging the high energy density and ultra-short pulse properties of the femtosecond laser, it induces a "nonlinear absorption" effect within the glass. This process causes the glass matrix at the focal point to melt instantaneously and then re-solidify, effectively fusing the two layers together.
A key feature of the equipment is its auto focus-tracking capability. It automatically detects and maintains the optimal focal position throughout the welding process, compensating for potential issues like glass thickness tolerances and warpage to ensure consistent, high-quality bonding.
The technology meets the demands for precision glass encapsulation across a wide range of industries, including medical devices, MEMS, the 3C industry, optical components and vacuum glass etc.